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an important notice at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, intellectual property matters and other important disclaimers. production data. tlv314-q1 , tlv2314-q1 , TLV4314-Q1 sbos837 ? november 2016 tlvx314-q1 3-mhz, low-power, internal emi filter, rrio, operational amplifier 1 1 features 1 ? qualified for automotive applications ? aec-q100 qualified with the following results: ? device temperature grade 1: ? 40 c to +125 c ambient operating temperature range ? device hbm esd classification level 3a ? device cdm esd classification level c6 ? low offset voltage: 0.75 mv (typical) ? low input bias current: 1 pa (typical) ? wide supply range: 1.8 v to 5.5 v ? rail-to-rail input and output ? gain bandwidth: 3 mhz ? low i q : 250 a/ch (maximum) ? low noise: 16 nv/ hz at 1 khz ? internal rf and emi filter ? number of channels: ? tlv314-q1: 1 ? tlv2314-q1: 2 ? TLV4314-Q1: 4 ? extended temperature range: ? 40 c to +125 c 2 applications ? low-side sensing ? battery management systems ? passive safety ? capacitive sensing ? fuel pumps 3 description the tlvx314-q1 family of single-, dual-, and quad- channel operational amplifiers represents a new generation of low-power, general-purpose operational amplifiers. rail-to-rail input and output swings (rrio), low quiescent current (150 a typically at 5 v) combine with a wide bandwidth of 3 mhz to make this family very attractive for a variety of battery- powered applications that require a good balance between cost and performance. the tlvx314-q1 family achieves a low-input bias current of 1 pa, making it an excellent choice for high impedance sensors. the robust design of the tlvx314-q1 devices provides ease-of-use to the circuit designer: unity- gain stability, rrio, capacitive loads of up to 300-pf, an integrated rf and emi rejection filter, no phase reversal in overdrive conditions, and high electrostatic discharge (esd) protection (4-kv hbm). these devices are optimized for low-voltage operation as low as 1.8 v ( 0.9 v) and up to 5.5 v ( 2.75 v), and are specified over the extended industrial temperature range of ? 40 c to +125 c. the tlv314-q1 (single) is available in both 5-pin sc70 and sot-23 packages. the tlv2314-q1 (dual) is offered in 8-pin soic and vssop packages. the quad-channel TLV4314-Q1 is offered in a 14-pin tssop package. device information (1) part number package body size (nom) tlv314-q1 sot-23 (5) 2.90 mm 1.60 mm sc70 (5) 2.00 mm 1.25 mm tlv2314-q1 (preview) vssop (8) 3.00 mm 3.00 mm soic (8) 4.90 mm 3.91 mm TLV4314-Q1 tssop (14) 5.00 mm 4.40 mm (1) for all available packages, see the orderable addendum at the end of the data sheet. emirr vs frequency productfolder 0 10 20 30 40 50 60 70 80 90 100 110 120 10m 100m 1g 10g frequency (hz) emirr in+ (db) support &community tools & software technical documents ordernow
2 tlv314-q1 , tlv2314-q1 , TLV4314-Q1 sbos837 ? november 2016 www.ti.com product folder links: tlv314-q1 tlv2314-q1 TLV4314-Q1 submit documentation feedback copyright ? 2016, texas instruments incorporated table of contents 1 features .................................................................. 1 2 applications ........................................................... 1 3 description ............................................................. 1 4 revision history ..................................................... 2 5 pin configuration and functions ......................... 3 6 specifications ......................................................... 6 6.1 absolute maximum ratings ...................................... 6 6.2 esd ratings ............................................................ 6 6.3 recommended operating conditions ....................... 6 6.4 thermal information: tlv314-q1 ............................. 7 6.5 thermal information: tlv2314-q1 ........................... 7 6.6 thermal information: TLV4314-Q1 ........................... 7 6.7 electrical characteristics ........................................... 8 6.8 typical characteristics .............................................. 9 6.9 typical characteristics ............................................ 10 7 detailed description ............................................ 13 7.1 overview ................................................................. 13 7.2 functional block diagram ....................................... 13 7.3 feature description ................................................. 14 7.4 device functional modes ........................................ 15 8 application and implementation ........................ 16 8.1 application information ............................................ 16 8.2 typical application ................................................. 16 8.3 system examples ................................................... 17 9 power supply recommendations ...................... 19 9.1 input and esd protection ....................................... 19 10 layout ................................................................... 20 10.1 layout guidelines ................................................. 20 10.2 layout example .................................................... 20 11 device and documentation support ................. 21 11.1 device support ...................................................... 21 11.2 documentation support ........................................ 21 11.3 related links ........................................................ 21 11.4 community resources .......................................... 21 11.5 trademarks ........................................................... 21 11.6 electrostatic discharge caution ............................ 21 11.7 glossary ................................................................ 21 12 mechanical, packaging, and orderable information ........................................................... 22 4 revision history date revision notes november 2016 * initial release.
3 tlv314-q1 , tlv2314-q1 , TLV4314-Q1 www.ti.com sbos837 ? november 2016 product folder links: tlv314-q1 tlv2314-q1 TLV4314-Q1 submit documentation feedback copyright ? 2016, texas instruments incorporated 5 pin configuration and functions tlv314-q1 dbv package 5-pin sot-23 top view tlv314-q1 dck package 5-pin sc70 top view pin functions: tlv314-q1 pin i/o description name dbv (sot-23) dck (sc70) ? in 4 3 i inverting input +in 3 1 i noninverting input out 1 4 o output v ? 2 2 ? negative (lowest) supply v+ 5 5 ? positive (highest) supply 12 3 54 v+- in out v - +in 12 3 54 v+out +in v - - in
4 tlv314-q1 , tlv2314-q1 , TLV4314-Q1 sbos837 ? november 2016 www.ti.com product folder links: tlv314-q1 tlv2314-q1 TLV4314-Q1 submit documentation feedback copyright ? 2016, texas instruments incorporated tlv2314-q1 d, dgk packages (1) 8-pin soic or vssop top view (1) preview only. pin functions: tlv2314-q1 pin i/o description name no. ? in a 2 i inverting input, channel a +in a 3 i noninverting input, channel a ? in b 6 i inverting input, channel b +in b 5 i noninverting input, channel b out a 1 o output, channel a out b 7 o output, channel b v ? 4 ? negative (lowest) supply v+ 8 ? positive (highest) supply 12 3 4 87 6 5 v+out b - in b +in b out a - in a +in a v -
5 tlv314-q1 , tlv2314-q1 , TLV4314-Q1 www.ti.com sbos837 ? november 2016 product folder links: tlv314-q1 tlv2314-q1 TLV4314-Q1 submit documentation feedback copyright ? 2016, texas instruments incorporated TLV4314-Q1 pw package 14-pin tssop top view pin functions: TLV4314-Q1 pin i/o description name no. ? in a 2 i inverting input, channel a +in a 3 i noninverting input, channel a ? in b 6 i inverting input, channel b +in b 5 i noninverting input, channel b ? in c 9 i inverting input, channel c +in c 10 i noninverting input, channel c ? in d 13 i inverting input, channel d +in d 12 i noninverting input, channel d out a 1 o output, channel a out b 7 o output, channel b out c 8 o output, channel c out d 14 o output, channel d v ? 11 ? negative (lowest) supply v+ 4 ? positive (highest) supply 12 3 4 1413 12 11 out d- in d +in d v - out a - in a +in a v+ 56 7 10 98 +in c- in c out c +in b - in b out b ab dc
6 tlv314-q1 , tlv2314-q1 , TLV4314-Q1 sbos837 ? november 2016 www.ti.com product folder links: tlv314-q1 tlv2314-q1 TLV4314-Q1 submit documentation feedback copyright ? 2016, texas instruments incorporated (1) stresses above these ratings may cause permanent damage. exposure to absolute maximum conditions for extended periods may degrade device reliability. these are stress ratings only, and functional operation of the device at these or any other conditions beyond those specified is not supported. (2) input pins are diode-clamped to the power-supply rails. input signals that can swing more than 0.5 v beyond the supply rails must be current limited to 10 ma or less. (3) short-circuit to ground, one amplifier per package. 6 specifications 6.1 absolute maximum ratings over operating free-air temperature range (unless otherwise noted). (1) min max unit supply voltage 7 v signal input pins voltage (2) (v ? ) ? 0.5 (v+) + 0.5 v current (2) ? 10 10 ma output short-circuit (3) continuous ma temperature specified, t a ? 40 125 c junction, t j 150 storage, t stg ? 65 150 (1) aec q100-002 indicates that hbm stressing shall be in accordance with the ansi/esda/jedec js-001 specification. 6.2 esd ratings value unit v (esd) electrostatic discharge human-body model (hbm), per aec q100-002 (1) 4000 v charged-device model (cdm), per aec q100-011 1000 6.3 recommended operating conditions over operating free-air temperature range (unless otherwise noted) min nom max unit v s supply voltage single-supply 1.8 5.5 v dual-supply 0.9 2.75 specified temperature range ? 40 125 c
7 tlv314-q1 , tlv2314-q1 , TLV4314-Q1 www.ti.com sbos837 ? november 2016 product folder links: tlv314-q1 tlv2314-q1 TLV4314-Q1 submit documentation feedback copyright ? 2016, texas instruments incorporated (1) for more information about traditional and new thermal metrics, see semiconductor and ic package thermal metrics (spra953). 6.4 thermal information: tlv314-q1 thermal metric (1) tlv314-q1 unit dbv (sot-23) dck (sc70) 5 pins 5 pins r ja junction-to-ambient thermal resistance 228.5 281.4 c/w r jc(top) junction-to-case(top) thermal resistance 99.1 91.6 c/w r jb junction-to-board thermal resistance 54.6 59.6 c/w jt junction-to-top characterization parameter 7.7 1.5 c/w jb junction-to-board characterization parameter 53.8 58.8 c/w (1) for more information about traditional and new thermal metrics, see semiconductor and ic package thermal metrics (spra953). 6.5 thermal information: tlv2314-q1 thermal metric (1) tlv2314-q1 unit d (soic) dgk (vssop) 8 pins 8 pins r ja junction-to-ambient thermal resistance 138.4 191.2 c/w r jc(top) junction-to-case(top) thermal resistance 89.5 61.9 c/w r jb junction-to-board thermal resistance 78.6 111.9 c/w jt junction-to-top characterization parameter 29.9 5.1 c/w jb junction-to-board characterization parameter 78.1 110.2 c/w (1) for more information about traditional and new thermal metrics, see semiconductor and ic package thermal metrics (spra953). 6.6 thermal information: TLV4314-Q1 thermal metric (1) TLV4314-Q1 unit pw (tssop) 14 pins r ja junction-to-ambient thermal resistance 121 c/w r jc(top) junction-to-case(top) thermal resistance 49.4 c/w r jb junction-to-board thermal resistance 62.8 c/w jt junction-to-top characterization parameter 5.9 c/w jb junction-to-board characterization parameter 62.2 c/w
8 tlv314-q1 , tlv2314-q1 , TLV4314-Q1 sbos837 ? november 2016 www.ti.com product folder links: tlv314-q1 tlv2314-q1 TLV4314-Q1 submit documentation feedback copyright ? 2016, texas instruments incorporated (1) parameters with minimum or maximum specification limits are 100% production tested at 25 o c, unless otherwise noted. over- temperature limits are based on characterization and statistical analysis. (2) specified by design and characterization; not production tested. (3) signifies the slower value of the positive or negative slew rate. (4) third-order filter; bandwidth = 80 khz at ? 3 db. 6.7 electrical characteristics v s = 1.8 v to 5.5 v; at t a = 25 c, r l = 10 k ? connected to v s / 2, v cm = v s / 2, and v out = v s / 2 (unless otherwise noted) (1) parameter test conditions min typ max unit offset voltage v os input offset voltage v cm = (v s +) ? 1.3 v, t a = 25 c 0.75 3 mv dv os /dt v os vs temperature t a = ? 40 c to +125 c 2 v/ c psrr power-supply rejection ratio v cm = (v s +) ? 1.3 v, t a = 25 c 30 135 v/v channel separation, dc at dc, t a = 25 c 100 db input voltage range v cm common-mode voltage range t a = 25 c (v ? ) ? 0.2 (v+) + 0.2 v cmrr common-mode rejection ratio v s = 5.5 v, (v s ? ) ? 0.2 v < v cm < (v s +) ? 1.3 v, t a = 25 c 72 96 db v s = 5.5 v, v cm = ? 0.2 v to 5.7 v (2) , t a = 25 c 75 input bias current i b input bias current t a = 25 c 1.0 pa i os input offset current t a = 25 c 1.0 pa noise input voltage noise (peak-to-peak) ? = 0.1 hz to 10 hz, t a = 25 c 5 v pp e n input voltage noise density ? = 10 khz, t a = 25 c 15 nv/ hz ? = 1 khz, t a = 25 c 16 i n input current noise density ? = 1 khz, t a = 25 c 6 fa/ hz input capacitance c in input capacitance differential v s = 5 v, t a = 25 c 1 pf common-mode v s = 5 v, t a = 25 c 5 open-loop gain a ol open-loop voltage gain v s = 1.8 v to 5.5 v, 0.2 v < v o < (v+) ? 0.2 v, r l = 10 k , t a = 25 c 85 115 db v s = 1.8 v to 5.5 v, 0.5 v < v o < (v+) ? 0.5 v, r l = 2 k (2) , t a = 25 c 85 100 phase margin v s = 5 v, g = 1, r l = 10 k , t a = 25 c 65 frequency response gbw gain-bandwidth product v s = 1.8 v, r l = 10 k , c l = 10 pf, t a = 25 c 2.7 mhz v s = 5 v, r l = 10 k , c l = 10 pf, t a = 25 c 3 sr slew rate (3) v s = 5 v, g = 1, t a = 25 c 1.5 v/ s t s settling time to 0.1%, v s = 5 v, 2-v step , g = 1, t a = 25 c 3 s overload recovery time v s = 5 v, v in gain > v s , t a = 25 c 8 s thd+n total harmonic distortion + noise (4) v s = 5 v, v o = 1 v rms , g = 1, f = 1 khz, r l = 10 k ? , t a = 25 c 0.005% output v o voltage output swing from supply rails v s = 1.8 v to 5.5 v, r l = 10 k , t a = 25 c 5 25 mv v s = 1.8 v to 5.5 v, r l = 2 k , t a = 25 c 22 45 i sc short-circuit current v s = 5 v, t a = 25 c 20 ma r o open-loop output impedance v s = 5.5 v, ? = 100 hz, t a = 25 c 570 power supply v s specified voltage range 1.8 5.5 v i q quiescent current per amplifier, over temperature v s = 5 v, i o = 0 ma, t a = ? 40 c to +125 c 150 250 a temperature specified range ? 40 125 c t stg storage range ? 65 150 c
9 tlv314-q1 , tlv2314-q1 , TLV4314-Q1 www.ti.com sbos837 ? november 2016 product folder links: tlv314-q1 tlv2314-q1 TLV4314-Q1 submit documentation feedback copyright ? 2016, texas instruments incorporated 6.8 typical characteristics table 1. table of graphs title figure open-loop gain and phase vs frequency figure 1 quiescent current vs supply voltage figure 2 offset voltage production distribution figure 3 offset voltage vs common-mode voltage (maximum supply) figure 4 input voltage noise spectral density vs frequency (1.8 v, 5.5 v) figure 5 input bias and offset current vs temperature figure 6 output voltage swing vs output current (overtemperature) figure 7 small-signal overshoot vs load capacitance figure 8 small-signal step response, noninverting (1.8 v) figure 9 large-signal step response, noninverting (1.8 v) figure 10 no phase reversal figure 11 channel separation vs frequency (dual) figure 12 emirr figure 13
10 tlv314-q1 , tlv2314-q1 , TLV4314-Q1 sbos837 ? november 2016 www.ti.com product folder links: tlv314-q1 tlv2314-q1 TLV4314-Q1 submit documentation feedback copyright ? 2016, texas instruments incorporated 6.9 typical characteristics at t a = 25 c, r l = 10 k ? connected to v s / 2, v cm = v s / 2, and v out = v s / 2 (unless otherwise noted) r l = 10 k and 10 pf, v s = 2.5 v figure 1. open-loop gain and phase vs frequency figure 2. quiescent current vs supply figure 3. offset voltage production distribution typical units, v s = 2.75 v figure 4. offset voltage vs common-mode voltage figure 5. input voltage noise spectral density vs frequency figure 6. input bias and offset current vs temperature 140120 100 8060 40 20 0 20 - 0 20 -- - - - - - - 4060 80 100 120 140 160 gain (db) phase () 10 1 100 1k 10k 100k 1m 10m frequency (hz) 180170 160 150 140 130 120 110 100 9080 quiescent current ( a/ch) m 1.5 2 2.5 3 3.5 4 4.5 5 5.5 6 supply voltage (v) 1210 86 4 2 0 percent of amplifiers (%) offset voltage (mv) - 1.4 - 1.3 - 1.2 - 1.1 - 1 - 0.9 - 0.8 - 0.7 - 0.6 - 0.5 - 0.4 - 0.3 - 0.2 - 0.1 0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.80.9 1 1.1 1.2 1.3 1.4 1000 800600 400 200 0 200400 600 800 1000 -- - - - offset voltage ( v) m - 2.75 0 - 2 - 1.25 - 0.5 0.5 1.25 2 2.75 common-mode voltage (v) 100 10 voltage noise (nv/ ) ? hz 10 100 1k 10k 100k frequency (hz) v = 2.75 v s v = 0.9 v s 1000 900800 700 600 500 400 300 200 100 0 input bias current (pa) - 50 - 25 0 25 50 75 100 125 150 temperature (c) i os i b
11 tlv314-q1 , tlv2314-q1 , TLV4314-Q1 www.ti.com sbos837 ? november 2016 product folder links: tlv314-q1 tlv2314-q1 TLV4314-Q1 submit documentation feedback copyright ? 2016, texas instruments incorporated typical characteristics (continued) at t a = 25 c, r l = 10 k ? connected to v s / 2, v cm = v s / 2, and v out = v s / 2 (unless otherwise noted) v s = 2.75 v figure 7. output voltage swing vs output current (overtemperature) v s = 2.75 v gain = 1 v/v r l = 10 k figure 8. small-signal overshoot vs load capacitance v s = 0.9 v gain = 1 v/v r f = 10 k figure 9. small-signal pulse response (noninverting) v s = 0.9 v gain = 1 v/v r l = 10 k figure 10. large-signal pulse response (noninverting) figure 11. no phase reversal v s = 2.75 v figure 12. channel separation vs frequency (tlv2314) 32 1 0 1 2 3 -- - output voltage swing (v) 0 5 10 15 20 25 30 35 40 output current (ma) - 40c 25c 125c 0 200 400 600 800 1000 1200 capacitive load (pf) 7060 50 40 30 20 10 0 overshoot (%) voltage (25 mv/div) time (1 s/div) m zz ll = 10 pf + 10 k w = 100 pf + 10 k w v in time (1 s/div) m 1 0.75 0.5 0.25 0 0.25 0.5 0.75 1 - - - - voltage (v) v in v out -- -- 6080 100120 140 - channel separation (db) 100 1k 10k 100k 1m 10m frequency (hz) 43 2 1 0 1 2 3 4 -- - - 0 250 500 750 1000 time (125 s/div) m voltage (1 v/div) vv in out
12 tlv314-q1 , tlv2314-q1 , TLV4314-Q1 sbos837 ? november 2016 www.ti.com product folder links: tlv314-q1 tlv2314-q1 TLV4314-Q1 submit documentation feedback copyright ? 2016, texas instruments incorporated typical characteristics (continued) at t a = 25 c, r l = 10 k ? connected to v s / 2, v cm = v s / 2, and v out = v s / 2 (unless otherwise noted) p rf = ? 10 dbm v s = 2.5 v v cm = 0 v figure 13. electromagnetic interference rejection ratio referred to noninverting input (emirr in+) vs frequency 0 10 20 30 40 50 60 70 80 90 100 110 120 10m 100m 1g 10g frequency (hz) emirr in+ (db)
13 tlv314-q1 , tlv2314-q1 , TLV4314-Q1 www.ti.com sbos837 ? november 2016 product folder links: tlv314-q1 tlv2314-q1 TLV4314-Q1 submit documentation feedback copyright ? 2016, texas instruments incorporated 7 detailed description 7.1 overview the tlvx314-q1 is a family of low-power, rail-to-rail input and output operational amplifiers specifically designed for portable applications. these devices operate from 1.8 v to 5.5 v, are unity-gain stable, and suitable for a wide range of general-purpose applications. the class ab output stage is capable of driving 10-k loads connected to any point between v+ and ground. the input common-mode voltage range includes both rails, and allows the tlvx314-q1 to be used in virtually any single-supply application. rail-to-rail input and output swing significantly increases dynamic range, especially in low-supply applications, and makes these devices suitable for driving sampling analog-to-digital converters (adcs). the tlvx314-q1 family features 3-mhz bandwidth and 1.5-v/ s slew rate with only 150- a supply current per channel, providing good ac performance at very-low-power consumption. dc applications are also well served with a very low input noise voltage of 14 nv / hz at 1 khz, low input bias current (0.2-pa), and a typical input offset voltage of 0.5 mv. 7.2 functional block diagram reference current v+ v in+ v inC vC (ground) v bias2 v bias1 class ab control circuitry v o copyright ? 2017, texas instruments incorporated
14 tlv314-q1 , tlv2314-q1 , TLV4314-Q1 sbos837 ? november 2016 www.ti.com product folder links: tlv314-q1 tlv2314-q1 TLV4314-Q1 submit documentation feedback copyright ? 2016, texas instruments incorporated 7.3 feature description 7.3.1 operating voltage the tlvx314-q1 series of operational amplifiers is fully specified and ensured for operation from 1.8 v to 5.5 v. in addition, many specifications apply from ? 40 c to +125 c. parameters that vary significantly with operating voltages or temperature are provided in the typical characteristics section. bypass power-supply pins with 0.01- f ceramic capacitors. 7.3.2 rail-to-rail input the input common-mode voltage range of the tlvx314-q1 extends 200 mv beyond the supply rails. this performance is achieved with a complementary input stage: an n-channel input differential pair in parallel with a p-channel differential pair, as shown in the functional block diagram . the n-channel pair is active for input voltages close to the positive rail, typically (v+) ? 1.3 v to 200 mv above the positive supply, and the p-channel pair is on for inputs from 200 mv below the negative supply to approximately (v+) ? 1.3 v. there is a small transition region, typically (v+) ? 1.4 v to (v+) ? 1.2 v, in which both pairs are on. this 200-mv transition region may vary up to 300 mv with process variation. thus, the transition region (with both stages on) ranges from (v+) ? 1.7 v to (v+) ? 1.5 v on the low end, up to (v+) ? 1.1 v to (v+) ? 0.9 v on the high end. within this transition region, psrr, cmrr, offset voltage, offset drift, and thd can degrade compared to device operation outside this region. 7.3.3 rail-to-rail output designed as a micro-power, low-noise operational amplifier, the tlvx314-q1 delivers a robust output drive capability. a class ab output stage with common-source transistors achieves full rail-to-rail output swing capability. for resistive loads up to 10-k , the output typically swings to within 5 mv of either supply rail regardless of the applied power-supply voltage . different load conditions change the ability of the amplifier to swing close to the rails, as shown in figure 7 . 7.3.4 common-mode rejection ratio (cmrr) the cmrr for the tlvx314-q1 is specified in several ways so the best match for a given application can be used; see the electrical characteristics table. first, the cmrr of the device in the common-mode range below the transition region [v cm < (v+) ? 1.3 v] is given. this specification is the best indicator of the capability of the device when the application requires using one of the differential input pairs. second, the cmrr over the entire common-mode range is specified at (v cm = ? 0.2 v to 5.7 v). this last value includes the variations measured through the transition region, as shown in figure 4 .
15 tlv314-q1 , tlv2314-q1 , TLV4314-Q1 www.ti.com sbos837 ? november 2016 product folder links: tlv314-q1 tlv2314-q1 TLV4314-Q1 submit documentation feedback copyright ? 2016, texas instruments incorporated feature description (continued) 7.3.5 capacitive load and stability the tlvx314-q1 is designed for applications where driving a capacitive load is required. as with all operational amplifiers, there may be specific instances where the tlvx314-q1 can become unstable. the particular operational amplifier circuit configuration, layout, gain, and output loading are some of the factors to consider when establishing whether or not an amplifier is stable in operation. an operational amplifier in the unity-gain (1 v/v) buffer configuration that drives a capacitive load exhibits a greater tendency to be unstable than an amplifier operated at a higher noise gain. the capacitive load, in conjunction with the operational amplifier output resistance, creates a pole within the feedback loop that degrades the phase margin. the degradation of the phase margin increases when capacitive loading increases. when operating in the unity-gain configuration, the tlvx314-q1 remains stable with a pure capacitive load up to approximately 1 nf. the equivalent series resistance (esr) of some very large capacitors (c l capacitors with a value greater than 1 f) is sufficient to alter the phase characteristics in the feedback loop so the amplifier remains stable. increasing the amplifier closed- loop gain allows the amplifier to drive increasingly larger capacitance. this increased capability is evident when measuring the overshoot response of the amplifier at higher voltage gains, as shown in figure 8 . inserting a small resistor (typically 10- to 20- ) can increase the capacitive load drive of the amplifier in a unity- gain configuration, as shown in figure 14 . this resistor significantly reduces the overshoot and ringing associated with large capacitive loads. one possible problem with this technique, however, is that a voltage divider is created with the added series resistor and any resistor connected in parallel with the capacitive load. the voltage divider introduces a gain error at the output that reduces the output swing. figure 14. improving capacitive load drive 7.3.6 emi susceptibility and input filtering operational amplifiers vary with regard to the susceptibility of the device to electromagnetic interference (emi). if conducted emi enters the operational amplifier, the dc offset at the amplifier output can shift from the nominal value when emi is present. this shift is a result of signal rectification associated with the internal semiconductor junctions. although emi can affect all operational amplifier pin functions, the signal input pins are likely to be the most susceptible. the tlvx314-q1 operational amplifier family incorporates an internal input low-pass filter that reduces the amplifiers response to emi. the filter provides common-mode and differential mode filtering. the filter is designed for a cutoff frequency of approximately 80 mhz ( ? 3 db), with a roll-off of 20 db per decade. texas instruments has developed the ability to accurately measure and quantify the immunity of an operational amplifier over a broad frequency spectrum extending from 10 mhz to 6 ghz. the emi rejection ratio (emirr) metric allows operational amplifiers to be directly compared to the emi immunity. figure 13 illustrates the testing results on the tlvx314-q1. for more detailed information, see emi rejection ratio of operational amplifiers (sboa128), available for download from www.ti.com . 7.4 device functional modes the tlvx314-q1 family has a single functional mode. these devices are powered on as long as the power- supply voltage is between 1.8 v ( 0.9 v) and 5.5 v ( 2.75 v). v in v out v+ r s 10 to 20 w w r l c l device
16 tlv314-q1 , tlv2314-q1 , TLV4314-Q1 sbos837 ? november 2016 www.ti.com product folder links: tlv314-q1 tlv2314-q1 TLV4314-Q1 submit documentation feedback copyright ? 2016, texas instruments incorporated 8 application and implementation note information in the following applications sections is not part of the ti component specification, and ti does not warrant its accuracy or completeness. ti ? s customers are responsible for determining suitability of components for their purposes. customers should validate and test their design implementation to confirm system functionality. 8.1 application information the tlvx314-q1 device is a low-power, rail-to-rail input and output operational amplifier specifically designed for portable applications. these devices operate from 1.8 v to 5.5 v, are unity-gain stable, and suitable for a wide range of general-purpose applications. the class ab output stage is capable of driving 10-k loads connected to any point between v+ and ground. the input common-mode voltage range includes both rails, and allows the tlvx314-q1 family to be used in virtually any single-supply application. rail-to-rail input and output swing significantly increases dynamic range, especially in low-supply applications, and makes the device suitable for driving sampling analog-to-digital converters (adcs). the tlvx314-q1 features a 3-mhz bandwidth and 1.5-v/ s slew rate with only 150- a supply current per channel, providing good ac performance at very-low-power consumption. dc applications are also well served with a very-low input noise voltage of 14 nv/ hz at 1 khz, low-input bias current (0.2 pa), and a typical input offset voltage of 0.5 mv. 8.2 typical application a typical application for an operational amplifier is an inverting amplifier, as shown in figure 15 . an inverting amplifier takes a positive voltage on the input and outputs a signal inverted to the input, making a negative voltage of the same magnitude. in the same manner, the amplifier also makes negative input voltages positive on the output. in addition, amplification can be added by selecting the input resistor (r i ) and the feedback resistor (r f ). figure 15. application schematic 8.2.1 design requirements the supply voltage must be chosen to be larger than the input voltage range and the desired output range. the limits of the input common-mode range (v cm ) and the output voltage swing to the rails (v o ) must also be considered. for instance, this application scales a signal of 0.5 v (1 v) to 1.8 v (3.6 v). setting the supply at 2.5 v is sufficient to accommodate this application. 8.2.2 detailed design procedure calculate the gain required by the inverting amplifier using equation 1 and equation 2 : (1) (2) v sup+ + v out r f v in r i v sup- v 1.8 a 3.6 0.5 out v in v a v
17 tlv314-q1 , tlv2314-q1 , TLV4314-Q1 www.ti.com sbos837 ? november 2016 product folder links: tlv314-q1 tlv2314-q1 TLV4314-Q1 submit documentation feedback copyright ? 2016, texas instruments incorporated typical application (continued) when the desired gain is determined, select a value for r i or r f . selecting a value in the kilohm range is desirable for general-purpose applications because the amplifier circuit uses currents in the milliamp range. this milliamp current range ensures the device does not draw too much current. the trade-off is that very large resistors (hundreds of kilohms) draw the smallest current, but generate the highest noise. very small resistors (hundreds of ohms) generate low noise but draw high current. this example uses 10 k for r i , and r f uses 36 k . these values are calculated using equation 3 : (3) 8.2.3 application curve figure 16. inverting amplifier input and output 8.3 system examples when receiving low-level signals, limiting the bandwidth of the incoming signals into the system is often required. the simplest way to establish this limited bandwidth is to place an rc filter at the noninverting terminal of the amplifier, as figure 17 shows. figure 17. single-pole, low-pass filter if even more attenuation is needed, a multiple pole filter is required. the sallen-key filter can be used for this task, as figure 18 shows. for best results, the amplifier must have a bandwidth that is eight to ten times the filter frequency bandwidth. failure to follow this guideline can result in phase shift of the amplifier. r g r f r 1 c 1 v in v out = 1 + v v out in r r f g 1 1 + sr c 1 1 ( ( ( ( 1 2 p r c 1 1 f = - 3 db time voltage (v) -2 -1.5 -1 -0.5 0 0.5 1 1.5 2 input output f v i r a r
18 tlv314-q1 , tlv2314-q1 , TLV4314-Q1 sbos837 ? november 2016 www.ti.com product folder links: tlv314-q1 tlv2314-q1 TLV4314-Q1 submit documentation feedback copyright ? 2016, texas instruments incorporated system examples (continued) figure 18. two-pole, low-pass, sallen-key filter r g r f r 2 r 1 c 2 v in v out 1 2 p rc f = - 3 db c 1 r r = r c c = c q = peaking factor (butterworth q = 0.707) 1 1 2 2 == r g = ( ( r f 2 - 1 q
19 tlv314-q1 , tlv2314-q1 , TLV4314-Q1 www.ti.com sbos837 ? november 2016 product folder links: tlv314-q1 tlv2314-q1 TLV4314-Q1 submit documentation feedback copyright ? 2016, texas instruments incorporated 9 power supply recommendations the tlvx314-q1 family is specified for operation from 1.8 v to 5.5 v ( 0.9 v to 2.75 v); many specifications apply from ? 40 c to +125 c. typical characteristics presents parameters that can exhibit significant variance with regard to operating voltage or temperature. caution supply voltages larger than 7 v can permanently damage the device (see the absolute maximum ratings table). place 0.1- f bypass capacitors close to the power-supply pins to reduce errors coupling in from noisy or high- impedance power supplies. for more detailed information on bypass capacitor placement; see layout guidelines . 9.1 input and esd protection the tlvx314-q1 family incorporates internal electrostatic discharge (esd) protection circuits on all pins. in the case of input and output pins, this protection primarily consists of current-steering diodes connected between the input and power-supply pins. these esd protection diodes provide in-circuit, input overdrive protection, as long as the current is limited to 10 ma, as stated in the absolute maximum ratings table. figure 19 shows how a series input resistor can be added to the driven input to limit the input current. the added resistor contributes thermal noise at the amplifier input, which must be kept to a minimum in noise-sensitive applications. figure 19. input current protection 5 k w 10-ma maximum v+ v in v out i overload device
20 tlv314-q1 , tlv2314-q1 , TLV4314-Q1 sbos837 ? november 2016 www.ti.com product folder links: tlv314-q1 tlv2314-q1 TLV4314-Q1 submit documentation feedback copyright ? 2016, texas instruments incorporated 10 layout 10.1 layout guidelines for best operational performance of the device, use good printed circuit board (pcb) layout practices, including: ? noise can propagate into analog circuitry through the power pins of the circuit as a whole and the operational amplifier. use bypass capacitors to reduce the coupled noise by providing low-impedance power sources local to the analog circuitry. ? connect low-esr, 0.1- f ceramic bypass capacitors between each supply pin and ground, placed as close to the device as possible. a single bypass capacitor from v+ to ground is applicable for single- supply applications. ? separate grounding for analog and digital portions of the circuitry is one of the simplest and most effective methods of noise suppression. one or more layers on multilayer pcbs are typically devoted to ground planes. a ground plane helps distribute heat and reduces emi noise pickup. take care to physically separate digital and analog grounds, paying attention to the flow of the ground current. for more detailed information, see circuit board layout techniques (sloa089). ? to reduce parasitic coupling, run the input traces as far away from the supply or output traces as possible. if these traces cannot be kept separate, crossing the sensitive trace perpendicularly is much better than crossing in parallel with the noisy trace. ? place the external components as close to the device as possible. keep r f and r g close to the inverting input in order to minimize parasitic capacitance, as shown in figure 20 . ? keep the length of input traces as short as possible. always remember that the input traces are the most sensitive part of the circuit. ? consider a driven, low-impedance guard ring around the critical traces. a guard ring can significantly reduce leakage currents from nearby traces that are at different potentials. 10.2 layout example figure 20. operational amplifier board layout for noninverting configuration n/c in +in v v+ output n/c n/c v s+ gnd vs gnd ground (gnd) plane on another layer. vout v in gnd run the input traces as far away from the supply lines as possible. use a low-esr, ceramic bypass capacitor. r f r g place components close to the device and to each other to reduce parasitic errors. + v in v out r g r f (schematic representation) use a low-esr, ceramic bypass capacitor.
21 tlv314-q1 , tlv2314-q1 , TLV4314-Q1 www.ti.com sbos837 ? november 2016 product folder links: tlv314-q1 tlv2314-q1 TLV4314-Q1 submit documentation feedback copyright ? 2016, texas instruments incorporated 11 device and documentation support 11.1 device support 11.1.1 development support 11.2 documentation support 11.2.1 related documentation for related documentation, see the following: ? emi rejection ratio of operational amplifiers (sboa128). ? circuit board layout techniques (sloa089). ? qfn/son pcb attachment (slua271). ? quad flatpack no-lead logic packages (scba017). 11.3 related links table 2 lists quick access links. categories include technical documents, support and community resources, tools and software, and quick access to sample or buy. table 2. related links parts product folder sample & buy technical documents tools & software support & community tlv314-q1 click here click here click here click here click here tlv2314-q1 click here click here click here click here click here TLV4314-Q1 click here click here click here click here click here 11.4 community resources the following links connect to ti community resources. linked contents are provided "as is" by the respective contributors. they do not constitute ti specifications and do not necessarily reflect ti's views; see ti's terms of use . ti e2e ? online community ti's engineer-to-engineer (e2e) community. created to foster collaboration among engineers. at e2e.ti.com, you can ask questions, share knowledge, explore ideas and help solve problems with fellow engineers. design support ti's design support quickly find helpful e2e forums along with design support tools and contact information for technical support. 11.5 trademarks e2e is a trademark of texas instruments. all other trademarks are the property of their respective owners. 11.6 electrostatic discharge caution these devices have limited built-in esd protection. the leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the mos gates. 11.7 glossary slyz022 ? ti glossary . this glossary lists and explains terms, acronyms, and definitions.
22 tlv314-q1 , tlv2314-q1 , TLV4314-Q1 sbos837 ? november 2016 www.ti.com product folder links: tlv314-q1 tlv2314-q1 TLV4314-Q1 submit documentation feedback copyright ? 2016, texas instruments incorporated 12 mechanical, packaging, and orderable information the following pages include mechanical, packaging, and orderable information. this information is the most current data available for the designated devices. this data is subject to change without notice and revision of this document. for browser-based versions of this data sheet, refer to the left-hand navigation.
package option addendum www.ti.com 17-oct-2018 addendum-page 1 packaging information orderable device status (1) package type package drawing pins package qty eco plan (2) lead/ball finish (6) msl peak temp (3) op temp (c) device marking (4/5) samples ptlv2314qdrq1 active soic d 8 2500 tbd call ti call ti -40 to 125 tlv2314qdrq1 preview soic d 8 2500 tbd call ti call ti -40 to 125 tlv314qdbvrq1 active sot-23 dbv 5 3000 green (rohs & no sb/br) cu nipdau level-2-260c-1 year -40 to 125 16sd tlv314qdbvtq1 active sot-23 dbv 5 250 green (rohs & no sb/br) cu nipdau level-2-260c-1 year -40 to 125 16sd tlv4314qpwrq1 active tssop pw 14 2000 green (rohs & no sb/br) cu nipdau level-2-260c-1 year -40 to 125 v4314q1 (1) the marketing status values are defined as follows: active: product device recommended for new designs. lifebuy: ti has announced that the device will be discontinued, and a lifetime-buy period is in effect. nrnd: not recommended for new designs. device is in production to support existing customers, but ti does not recommend using this part in a new design. preview: device has been announced but is not in production. samples may or may not be available. obsolete: ti has discontinued the production of the device. (2) rohs: ti defines "rohs" to mean semiconductor products that are compliant with the current eu rohs requirements for all 10 rohs substances, including the requirement that rohs substance do not exceed 0.1% by weight in homogeneous materials. where designed to be soldered at high temperatures, "rohs" products are suitable for use in specified lead-free processes. ti may reference these types of products as "pb-free". rohs exempt: ti defines "rohs exempt" to mean products that contain lead but are compliant with eu rohs pursuant to a specific eu rohs exemption. green: ti defines "green" to mean the content of chlorine (cl) and bromine (br) based flame retardants meet js709b low halogen requirements of <=1000ppm threshold. antimony trioxide based flame retardants must also meet the <=1000ppm threshold requirement. (3) msl, peak temp. - the moisture sensitivity level rating according to the jedec industry standard classifications, and peak solder temperature. (4) there may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) multiple device markings will be inside parentheses. only one device marking contained in parentheses and separated by a "~" will appear on a device. if a line is indented then it is a continuation of the previous line and the two combined represent the entire device marking for that device. (6) lead/ball finish - orderable devices may have multiple material finish options. finish options are separated by a vertical ruled line. lead/ball finish values may wrap to two lines if the finish value exceeds the maximum column width. important information and disclaimer: the information provided on this page represents ti's knowledge and belief as of the date that it is provided. ti bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. efforts are underway to better integrate information from third parties. ti has taken and
package option addendum www.ti.com 17-oct-2018 addendum-page 2 continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. ti and ti suppliers consider certain information to be proprietary, and thus cas numbers and other limited information may not be available for release. in no event shall ti's liability arising out of such information exceed the total purchase price of the ti part(s) at issue in this document sold by ti to customer on an annual basis. other qualified versions of tlv2314-q1, tlv314-q1, TLV4314-Q1 : ? catalog: tlv2314 , tlv314 , tlv4314 note: qualified version definitions: ? catalog - ti's standard catalog product
tape and reel information *all dimensions are nominal device package type package drawing pins spq reel diameter (mm) reel width w1 (mm) a0 (mm) b0 (mm) k0 (mm) p1 (mm) w (mm) pin1 quadrant tlv314qdbvrq1 sot-23 dbv 5 3000 178.0 9.0 3.23 3.17 1.37 4.0 8.0 q3 tlv314qdbvtq1 sot-23 dbv 5 250 178.0 9.0 3.23 3.17 1.37 4.0 8.0 q3 tlv4314qpwrq1 tssop pw 14 2000 330.0 12.4 6.9 5.6 1.6 8.0 12.0 q1 package materials information www.ti.com 9-oct-2017 pack materials-page 1
*all dimensions are nominal device package type package drawing pins spq length (mm) width (mm) height (mm) tlv314qdbvrq1 sot-23 dbv 5 3000 180.0 180.0 18.0 tlv314qdbvtq1 sot-23 dbv 5 250 180.0 180.0 18.0 tlv4314qpwrq1 tssop pw 14 2000 367.0 367.0 35.0 package materials information www.ti.com 9-oct-2017 pack materials-page 2

www.ti.com package outline c typ 0.22 0.08 0.25 3.0 2.6 2x 0.95 1.9 1.45 max typ 0.15 0.00 5x 0.5 0.3 typ 0.6 0.3 typ 8 0 1.9 a 3.05 2.75 b 1.75 1.45 (1.1) sot-23 - 1.45 mm max height dbv0005a small outline transistor 4214839/c 04/2017 notes: 1. all linear dimensions are in millimeters. any dimensions in parenthesis are for reference only. dimensioning and tolerancing per asme y14.5m. 2. this drawing is subject to change without notice. 3. refernce jedec mo-178. 0.2 c a b 1 3 4 5 2 index area pin 1 gage plane seating plane 0.1 c scale 4.000
www.ti.com example board layout 0.07 max arround 0.07 min arround 5x (1.1) 5x (0.6) (2.6) (1.9) 2x (0.95) (r0.05) typ 4214839/c 04/2017 sot-23 - 1.45 mm max height dbv0005a small outline transistor notes: (continued) 4. publication ipc-7351 may have alternate designs. 5. solder mask tolerances between and around signal pads can vary based on board fabrication site. symm land pattern example exposed metal shown scale:15x pkg 1 3 4 5 2 solder mask opening metal under solder mask solder mask defined exposed metal metal solder mask opening non solder mask defined (preferred) solder mask details exposed metal
www.ti.com example stencil design (2.6) (1.9) 2x(0.95) 5x (1.1) 5x (0.6) (r0.05) typ sot-23 - 1.45 mm max height dbv0005a small outline transistor 4214839/c 04/2017 notes: (continued) 6. laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. ipc-7525 may have alternate design recommendations. 7. board assembly site may have different recommendations for stencil design. solder paste example based on 0.125 mm thick stencil scale:15x symm pkg 1 3 4 5 2
www.ti.com package outline c typ 0.22 0.08 0.25 3.0 2.6 2x 0.95 1.9 1.45 max typ 0.15 0.00 5x 0.5 0.3 typ 0.6 0.3 typ 8 0 1.9 a 3.05 2.75 b 1.75 1.45 (1.1) sot-23 - 1.45 mm max height dbv0005a small outline transistor 4214839/c 04/2017 notes: 1. all linear dimensions are in millimeters. any dimensions in parenthesis are for reference only. dimensioning and tolerancing per asme y14.5m. 2. this drawing is subject to change without notice. 3. refernce jedec mo-178. 0.2 c a b 1 3 4 5 2 index area pin 1 gage plane seating plane 0.1 c scale 4.000
www.ti.com example board layout 0.07 max arround 0.07 min arround 5x (1.1) 5x (0.6) (2.6) (1.9) 2x (0.95) (r0.05) typ 4214839/c 04/2017 sot-23 - 1.45 mm max height dbv0005a small outline transistor notes: (continued) 4. publication ipc-7351 may have alternate designs. 5. solder mask tolerances between and around signal pads can vary based on board fabrication site. symm land pattern example exposed metal shown scale:15x pkg 1 3 4 5 2 solder mask opening metal under solder mask solder mask defined exposed metal metal solder mask opening non solder mask defined (preferred) solder mask details exposed metal
www.ti.com example stencil design (2.6) (1.9) 2x(0.95) 5x (1.1) 5x (0.6) (r0.05) typ sot-23 - 1.45 mm max height dbv0005a small outline transistor 4214839/c 04/2017 notes: (continued) 6. laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. ipc-7525 may have alternate design recommendations. 7. board assembly site may have different recommendations for stencil design. solder paste example based on 0.125 mm thick stencil scale:15x symm pkg 1 3 4 5 2

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